Package structures to improve on-chip antenna performance
US8917210B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 27, 2012 |
| Grant date | Dec 23, 2014 |
| Priority date | — |
| Expiry date | Jun 14, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73265
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A radio frequency integrated circuit (RFIC) chip package is provided having an RFIC chip and an integrated antenna structure. The integrated antenna structure includes an on-chip antenna having one or more radiator elements formed as part of a back-end-of-line structure of the RFIC chip. The antenna structure further includes a superstrate structure disposed on the back-end-of-line structure of the RFIC chip. The superstrate structure includes at least one substrate layer and a focusing metal element. The focusing metal element has a structure that is complementary to the on-chip radiator elements and which is configured to focus electromagnetic radiation to and from the planar antenna structure. The superstrate structure improves the performance (e.g., antenna gain and bandwidth) of the on-chip antennas for millimeter-wave applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.