Semiconductor device with micro electromechanical system die
US8921955B1 · kind B1 · utility
10Cited by
16References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 24, 2011 |
| Grant date | Dec 30, 2014 |
| Priority date | — |
| Expiry date | Nov 1, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16151
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
In one embodiment, a miniaturized, multi-function, highly integrated and high performance semiconductor device or package includes a microphone implemented using a MEMS (Micro Electro Mechanical System) die. The semiconductor device includes a leadframe and a body collectively defining a port hole. The port hole facilitates the exposure of a diaphragm of the MEMS die in the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.