Semiconductor manufacturing and semiconductor device with semiconductor structure

US8921974B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Thoralf Kautzsch · Dresden, DE
• Boris Binder · Dresden, DE
• Uwe Rudolph · Dresden, DE
• Frank Hoffman · New Baltimore, US

Key dates

• Filing date: Jun 6, 2013
• Grant date: Dec 30, 2014
• Expiry date: Jun 6, 2033

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C2201/0116
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

Embodiments related to semiconductor manufacturing and semiconductor devices with semiconductor structure are described and depicted.