Inventor · Dresden, DE

Boris Binder

18Patents
3h-index
24Co-inventors
56Inventor score

Filing activity: Sep 11, 2008 → Nov 25, 2020

Most-cited inventions

PatentTitleAreaCited byStatus
US9382111B2 Micromechanical system and method for manufacturing a micromechanical system Performing Operations; Transporting 10 Active
US8481400B2 Semiconductor manufacturing and semiconductor device with semiconductor structure Performing Operations; Transporting 8 Active
US7832279B2 Semiconductor device including a pressure sensor Physics 8 Active
US8994127B2 Method of fabricating isolating semiconductor structures using a layout of trenches and openings Performing Operations; Transporting 2 Active
US8266962B2 Acceleration sensor Performing Operations; Transporting 2 Active
US8921974B2 Semiconductor manufacturing and semiconductor device with semiconductor structure Performing Operations; Transporting 2 Active
US9376314B2 Method for manufacturing a micromechanical system Physics 1 Active
US8518732B2 Method of providing a semiconductor structure with forming a sacrificial structure Electricity 1 Active
US9546923B2 Sensor structures, systems and methods with improved integration and optimized footprint Performing Operations; Transporting 1 Active
US9527725B2 Semiconductor structure with lamella defined by singulation trench Physics 1 Active
US8723276B2 Semiconductor structure with lamella defined by singulation trench Physics 1 Active
US8921954B2 Method of providing a semiconductor structure with forming a sacrificial structure Electricity 1 Active
US9236241B2 Wafer, a method for processing a wafer, and a method for processing a carrier Emerging Cross-Sectional Technologies 0 Active
US8627720B2 Acceleration sensor Performing Operations; Transporting 0 Active
US11393714B2 Producing a buried cavity in a semiconductor substrate Electricity 0 Active
US9752943B2 Sensor structures, systems and methods with improved integration and optimized footprint Performing Operations; Transporting 0 Active
US11869919B2 Method for manufacturing a sensor device with a buried deep trench structure and sensor device Electricity 0 Active
US10060816B2 Sensor structures, systems and methods with improved integration and optimized footprint Performing Operations; Transporting 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.