Looped interconnect structure
US8927877B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2012 |
| Grant date | Jan 6, 2015 |
| Priority date | — |
| Expiry date | Jan 22, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49204
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is a system and method for mounting packages by forming one or more wire loop interconnects, optionally, with a wirebonder, and mounting the interconnects to a mounting pad on a first substrate. A first and second stud ball may each have at least one flat surface be disposed on a single mounting pad, and a wire having a bend region and forming a loop may be disposed between the stud balls. The stud balls may be formed from a deformed mouthing node formed on a wire. The loop may be mounted on a mounting pad on a first substrate and a second substrate may be mounted on the loop via a conductive material such as solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.