Image sensor packaging structure with black encapsulant
US8928104B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 17, 2010 |
| Grant date | Jan 6, 2015 |
| Priority date | — |
| Expiry date | Aug 5, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/806
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An image sensor packaging structure with a low transmittance encapsulant is provided. The image sensor packaging structure includes a substrate, a chip, a transparent lid, and the low transmittance encapsulant. The chip is combined with the substrate. The transparent lid is adhered to the chip and cover above a sensitization area of the chip to form an air cavity. The low transmittance encapsulant is formed on the substrate and encapsulates the chip and the transparent lid so as to accomplish the package of the image sensor packaging structure. Due to the feature of prohibiting from light passing through the low transmittance encapsulant, the arrangement of the low transmittance encapsulant can avoid the light from outside interfere the image sensing effect of the image sensor. Therefore, the quality of the image sensing can be ensured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.