Ren-Long Kuo
9Patents
4h-index
13Co-inventors
50Inventor score
Filing activity: Aug 21, 2001 → Jan 25, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8481343B2 | Manufacturing method of molded image sensor packaging structure with predetermined focal length and the structure using the same | Electricity | 18 | Active |
| US6632037B2 | Keyboard assembly with positioning function | Electricity | 5 | Expired |
| US8390087B2 | Image sensor package structure with large air cavity | Electricity | 5 | Active |
| US8093674B2 | Manufacturing method for molding image sensor package structure and image sensor package structure thereof | Electricity | 4 | Active |
| US8847146B2 | Image sensor package structure with casing including a vent without sealing and in communication with package material | Electricity | 3 | Active |
| US8928104B2 | Image sensor packaging structure with black encapsulant | Electricity | 3 | Active |
| US8441086B2 | Image sensor packaging structure with predetermined focal length | Electricity | 1 | Active |
| US8378441B2 | Manufacturing method and structure of a wafer level image sensor module with package structure | Electricity | 0 | Active |
| US8828777B2 | Wafer level image sensor packaging structure and manufacturing method of the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.