Plasma processing apparatus
US8931433B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2008 |
| Grant date | Jan 13, 2015 |
| Priority date | — |
| Expiry date | Jan 26, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03C2218/153
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention aims at providing a plasma processing apparatus for performing a plasma processing on a planar substrate body to be processed, the apparatus being capable of generating the plasma with good uniformity and efficiently using the plasma, and having a high productivity. That is, the plasma processing apparatus according to the present invention includes: a vacuum chamber; one or plural antenna supporters (plasma generator supporters) projecting into the internal space of the vacuum chamber; radio-frequency antennas (plasma generators) attached to each antenna supporter; and a pair of substrate body holders provided across the antenna supporter in the vacuum chamber, for holding a planar substrate body to be processed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.