Chemical dispensing system and method
US8932962B2 · kind B2 · utility
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3References
10Claims
0Family size
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Key dates
| Filing date | Apr 9, 2012 |
| Grant date | Jan 13, 2015 |
| Priority date | — |
| Expiry date | Sep 3, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for dispensing a liquid etchant onto a wafer dispenses the liquid etchant onto a wafer using a scanning dispensing nozzle while controlling the dispensing temperature of the etchant in real time as a function of the radial position of the dispensing nozzle over the wafer. The dispensing temperature of the etchant is controlled to enhance the effectiveness of the etchant and thus compensate for the lower etching rate zones in the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.