Monitoring incident beam position in a wafer inspection system
US8934091B2 · kind B2 · utility
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3References
22Claims
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Assignee
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Key dates
| Filing date | Mar 11, 2013 |
| Grant date | Jan 13, 2015 |
| Priority date | — |
| Expiry date | Jul 12, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/681
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Methods, systems, and structures for monitoring incident beam position in a wafer inspection system are provided. One structure includes a feature formed in a chuck configured to support a wafer during inspection by the wafer inspection system. The chuck rotates the wafer in a theta direction and simultaneously translates the wafer in a radial direction during the inspection. An axis through the center of the feature is aligned with a radius of the chuck such that a position of the axis relative to an incident beam of the wafer inspection system indicates changes in the incident beam position in the theta direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.