Methods for fabricating a semiconductor wafer processing device
US8940094B2 · kind B2 · utility
3Cited by
3References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 10, 2012 |
| Grant date | Jan 27, 2015 |
| Priority date | — |
| Expiry date | Oct 24, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of fabricating a semiconductor processing device includes providing a susceptor including a substantially cylindrical body portion having opposing upper and lower surfaces. The body portion has a diameter larger than a wafer diameter. The method also includes providing a set of holes circumferentially disposed at a first susceptor diameter, the set of holes being evenly spaced with respect to adjacent holes and extending through the upper and lower surfaces in an area. The first susceptor diameter is larger than the wafer diameter, and holes are omitted along the first diameter in a set of predetermined orientations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.