Patent · US Active

Electronic component

US8947886B2 · kind B2 · utility

0Cited by

3References

26Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Joachim Mahler · Regensburg, DE
Manfred Mengel · Bad Abbach, DE
Khalil Hosseini · Weihmichl, DE
Klaus Schmidt · Schwieberdingen, DE
Franz-Peter Kalz · Regensburg, DE

Key dates

Filing date	Jul 19, 2011
Grant date	Feb 3, 2015
Priority date	—
Expiry date	Mar 7, 2032

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/4913
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An electronic component includes an electrically conductive carrier. The electrically conductive carrier includes a carrier surface and a semiconductor chip includes a chip surface. One or both of the carrier surface and the chip surface include a non-planar structure. The chip is attached to the carrier with the chip surface facing towards the carrier surface so that a gap is provided between the chip surface and the carrier surface due to the non-planar structure of one or both of the carrier surface and the first chip surface. The electronic component further includes a first galvanically deposited metallic layer situated in the gap.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.