Signal shifting to allow independent control of identical stacked memory modules
US8952515B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 11, 2012 |
| Grant date | Feb 10, 2015 |
| Priority date | — |
| Expiry date | Apr 20, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatus and methods are disclosed to allow independent control of stacked memory modules. In one embodiment, an apparatus may comprise first, second, and third modules, each of the first, second and third modules having a plurality of stacked memory dice, at least some of the plurality of stacked memory dice including a Chip Enable (CE) signal electrically accessible from a bottom surface of a corresponding module of the first, second and third modules. The apparatus may comprise a Package-on-Package (PoP) structure where the first, second and third modules are attached to one another such that an individual access to each CE signal associated with the PoP structure is provided from the bottom surface of the corresponding module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.