Patent · US Active

Semiconductor packages with integrated antenna and method of forming thereof

US8952521B2 · kind B2 · utility

77Cited by

4References

28Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Maciej Wojnowski · Munich, DE
Walter Hartner · Munich, DE
Ottmar Geitner · Pentling, DE
Gottfried Beer · Nittendorf, DE
Klaus Pressel · Regensburg, DE
Mehran Pour Mousavi · Munich, DE

Key dates

Filing date	Jan 8, 2013
Grant date	Feb 10, 2015
Priority date	—
Expiry date	Jan 24, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In one embodiment of the present invention, a semiconductor package includes a substrate having a first major surface and an opposite second major surface. A chip is disposed in the substrate. The chip includes a plurality of contact pads at the first major surface. A first antenna structure is disposed at the first major surface. A reflector is disposed at the second major surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.