Ottmar Geitner
9Patents
4h-index
29Co-inventors
49Inventor score
Filing activity: Apr 18, 2008 → Dec 12, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8952521B2 | Semiconductor packages with integrated antenna and method of forming thereof | Electricity | 77 | Active |
| US7759163B2 | Semiconductor module | Electricity | 35 | Active |
| US8669655B2 | Chip package and a method for manufacturing a chip package | Electricity | 19 | Active |
| US9275926B2 | Power module with cooling structure on bonding substrate for cooling an attached semiconductor chip | Electricity | 19 | Active |
| US9589922B2 | Electronic module and method of manufacturing the same | Emerging Cross-Sectional Technologies | 3 | Active |
| US9532459B2 | Electronic module and method of manufacturing the same | Emerging Cross-Sectional Technologies | 1 | Active |
| US9585241B2 | Substrate, chip arrangement, and method for manufacturing the same | Emerging Cross-Sectional Technologies | 1 | Active |
| US9847274B2 | Electronic module and method of manufacturing the same | Emerging Cross-Sectional Technologies | 0 | Active |
| US11574889B2 | Power module comprising two substrates and method of manufacturing the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.