Patent · US Active

Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof

US8952545B2 · kind B2 · utility

3Cited by

9References

10Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Ralf Otremba · Kaufbeuren, DE
Henrik Ewe · Burglengenfeld, DE
Klaus Schiess · Allensbach, DE
Manfred Mengel · Bad Abbach, DE

Key dates

Filing date	Aug 13, 2013
Grant date	Feb 10, 2015
Priority date	—
Expiry date	Aug 21, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

One aspect is a device including a carrier comprising a first conducting layer, a first insulating layer over the first conducting layer, and at least one first through-connection from a first face of the first insulating layer to a second face of the first insulating layer. A semiconductor chip is attached to the carrier and a second insulating layer is over the carrier and the semiconductor chip. A metal layer is over the second insulating layer. A second through-connection is through the second insulating layer electrically coupling the semiconductor chip to the metal layer. A third through-connection is through the second insulating layer electrically coupling the carrier to the metal layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.