Patent · US Active

Method for fabricating a bond

US8955219B2 · kind B2 · utility

0Cited by

8References

24Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Roman Roth · Sattendorf, AT
Dirk Siepe · Dortmund, DE

Key dates

Filing date	Feb 22, 2010
Grant date	Feb 17, 2015
Priority date	—
Expiry date	Feb 22, 2033

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49169
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The invention relates to a method for fabricating a bond by providing a body including a metallic surface provided with an inorganic, dielectric protective layer. The protective layer covers at least one surface zone of the metallic surface in which the metallic surface is to be electrically conductive bonded to a contact conductor. To fabricate the bond, a portion of a provided contact conductor above the surface zone is pressed on to the protective layer and the body so that the protective layer is destroyed above the surface zone in achieving an electrically conductive bond between the metallic surface and the contact conductor.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.