Thermal processing system for curing dielectric films
US8956457B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Sep 8, 2006 |
| Grant date | Feb 17, 2015 |
| Priority date | — |
| Expiry date | Jan 7, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02282
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermal processing system and method for curing a dielectric film. The thermal processing system is configured to treat the dielectric film with ultraviolet (UV) radiation and infrared (IR) radiation in order to cure the dielectric film. The thermal processing system can include an array if IR and UV light-emitting devices (LEDs) configured to irradiate a substrate having a low dielectric constant (low-k) film. The method dries the dielectric film to remove contaminants from the film and exposes the dielectric film at a single stage to ultraviolet radiation and IR radiation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.