Patent · US Active

Metal plating compositions and methods

US8956523B2 · kind B2 · utility

0Cited by

6References

1Claims

0Family size

Assignee

Rohm and Haas Electronic Materials LLC · US

Inventors

Erik Reddington · Ashland, US
Gonzalo Urrutia Desmaison · Berlin, DE
Zukra I. Niazimbetova · Westborough, US
Donald E. Cleary · Littleton, US
Mark Lefebvre · Hudson, US

Key dates

Filing date	Sep 16, 2012
Grant date	Feb 17, 2015
Priority date	—
Expiry date	Jan 27, 2033

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC07C235/10
WIPO fieldOrganic fine chemistry
WIPO sectorChemistry

Abstract

Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.