Patent · US Active

Wetting pretreatment for enhanced damascene metal filling

US8962085B2 · kind B2 · utility

17Cited by

52References

58Claims

0Family size

Assignee

Novellus Systems, Inc. · US

Inventors

Steven T. Mayer · Lake Oswego, US
David W. Porter · Tulsa, US
Mark J. Willey · Portland, US

Key dates

Filing date	Jan 8, 2010
Grant date	Feb 24, 2015
Priority date	—
Expiry date	Apr 12, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/76898
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

Disclosed are pre-wetting apparatus designs and methods. These apparatus designs and methods are used to pre-wet a wafer prior to plating a metal on the surface of the wafer. Disclosed compositions of the pre-wetting fluid prevent corrosion of a seed layer on the wafer and also improve the filling rates of features on the wafer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.