Systems and methods of wafer grinding
US8968052B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2012 |
| Grant date | Mar 3, 2015 |
| Priority date | — |
| Expiry date | May 24, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/013
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Systems and methods are provided for use in processing and/or grinding wafers or other work products. Some embodiments provide a grinding apparatus that comprise a base casting; a rotary indexer configured to rotate within the base casting; a work spindle secured with the rotary indexer; a work chuck coupled with the first work spindle, wherein the first work spindle is configured to rotate the first work chuck; a bridge casting secured relative to the base casting, wherein the bridge casting bridges across at least a portion of the rotary indexer and is supported structurally forming a closed stiffness loop; a grind spindle secured with the bridge casting; and a grind wheel cooperated with the grind spindle, wherein the bridge casting secures the grind spindle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.