Patent · US Active

Embedded semiconductive chips in reconstituted wafers, and systems containing same

US8969140B2 · kind B2 · utility

7Cited by
71References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 14, 2013
Grant dateMar 3, 2015
Priority date—
Expiry dateAug 14, 2033

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/3025
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A reconstituted wafer includes a rigid mass with a flat surface and a base surface disposed parallel planar to the flat surface. A plurality of dice are embedded in the rigid mass. The plurality of dice include terminals that are exposed through coplanar with the flat surface. A process of forming the reconstituted wafer includes removing some of the rigid mass to expose the terminals, while retaining the plurality of dice in the rigid mass. A process of forming an apparatus includes separating one apparatus from the reconstituted wafer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.