Extending metal traces in bump-on-trace structures
US8970033B2 · kind B2 · utility
7Cited by
2References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2011 |
| Grant date | Mar 3, 2015 |
| Priority date | — |
| Expiry date | Feb 1, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device includes a work piece, and a metal trace on a surface of the work piece. A Bump-on-Trace (BOT) is formed at the surface of the work piece. The BOT structure includes a metal bump, and a solder bump bonding the metal bump to a portion of the metal trace. The metal trace includes a metal trace extension not covered by the solder bump.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.