Insert carrier and method for the simultaneous double-side material-removing processing of semiconductor wafers

US8974267B2 · kind B2 · utility

Assignee

• Siltronic AG · DE

Inventors

• Georg Pietsch · Burghausen, DE
• Michael Kerstan · Burghausen, DE

Key dates

• Filing date: Dec 6, 2011
• Grant date: Mar 10, 2015
• Expiry date: May 26, 2033

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B24B37/28
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

An insert carrier is configured to receive at least one semiconductor wafer for double-side processing of the wafer between two working disks of a lapping, grinding or polishing process. The insert carrier includes a core of a first material that has a first surface and a second surface, and at least one opening configured to receive a semiconductor wafer. A coating at least partially covers the first and second surfaces of the core. The coating includes a surface remote from the core that includes a structuring including elevations and depressions. A correlation length of the elevations and depressions is in a range of 0.5 mm to 25 mm and an aspect ratio of the structuring is in a range of 0.0004 to 0.4.