Device and method for treating wafer-shaped articles
US8974632B2 · kind B2 · utility
0Cited by
5References
8Claims
0Family size
Assignee
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Key dates
| Filing date | Nov 30, 2011 |
| Grant date | Mar 10, 2015 |
| Priority date | — |
| Expiry date | Jul 15, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6719
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and device for processing wafer-shaped articles comprises a closed process chamber. A rotary chuck is located within the process chamber, and is adapted to hold a wafer shaped article thereon. An interior fluid distribution ring is positioned above the rotary chuck, and comprises an annular surface inclined downwardly from a radially inner edge to a radially outer edge thereof. At least one fluid distribution nozzle extends into the closed process chamber and is positioned so as to discharge fluid onto the annular surface of the fluid distribution ring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.