Patent · US Active

Component having a via and method for manufacturing it

US8975118B2 · kind B2 · utility

0Cited by

0References

5Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Julian Gonska · Reutlingen, DE
Jens Frey · Echterdingen, DE
Heribert Weber · Leverkusen, DE
Eckhard Graf · Gomaringen, DE
Roman Schlosser · Waldkirch, DE

Key dates

Filing date	Apr 13, 2011
Grant date	Mar 10, 2015
Priority date	—
Expiry date	Apr 21, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/1461
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An advantageous method and system for realizing electrically very reliable and mechanically extremely stable vias for components whose functionality is realized in a layer construction on a conductive substrate. The via (Vertical Interconnect Access), which is led to the back side of the component and which is used for the electrical contacting of functional elements realized in the layer construction, includes a connection area in the substrate that extends over the entire thickness of the substrate and is electrically insulated from the adjoining substrate by a trench-like insulating frame likewise extending over the entire substrate thickness. According to the present system, the trench-like insulating frame is filled up with an electrically insulating polymer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.