Carrier bonding and detaching processes for a semiconductor wafer
US8975157B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 8, 2012 |
| Grant date | Mar 10, 2015 |
| Priority date | — |
| Expiry date | Sep 4, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12042
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a temporary carrier bonding and detaching process. A first surface of a semiconductor wafer is mounted on a first carrier by a first adhesive, and a first isolation coating is disposed between the first adhesive and the first carrier. Then, a second carrier is mounted on the second surface of the semiconductor wafer. The first carrier is detached. The method of the present invention utilizes the second carrier to support and protect the semiconductor wafer, after which the first carrier is detached. Therefore, the semiconductor wafer will not be damaged or broken, thereby improving the yield rate of the semiconductor process. Furthermore, the simplicity of the detaching method for the first carrier allows for improvement in efficiency of the semiconductor process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.