Chemical mechanical polishing (CMP) composition comprising a non-ionic surfactant and a carbonate salt
US8980750B2 · kind B2 · utility
2Cited by
3References
14Claims
0Family size
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Key dates
| Filing date | Jul 2, 2013 |
| Grant date | Mar 17, 2015 |
| Priority date | — |
| Expiry date | Jul 2, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A chemical mechanical polishing (CMP) composition (Q) comprising
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.