Wei-Lan Chiu
10Patents
2h-index
14Co-inventors
47Inventor score
Filing activity: Oct 4, 2011 → Sep 14, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8957323B2 | Electrical connecting element having nano-twinned copper, method of fabricating the same, and electrical connecting structure comprising the same | Emerging Cross-Sectional Technologies | 6 | Active |
| US8980750B2 | Chemical mechanical polishing (CMP) composition comprising a non-ionic surfactant and a carbonate salt | Electricity | 2 | Active |
| US10520422B2 | Optical micro-particles detector | Physics | 1 | Active |
| US12351737B2 | Chemical mechanical polishing of substrates containing copper and ruthenium | Electricity | 0 | Active |
| US9070632B2 | Aqueous polishing composition and process for chemically mechanically polishing substrates having patterned or unpatterned low-k dielectric layers | Electricity | 0 | Active |
| US10161054B2 | Preferably oriented nanotwinned Au film, method of preparing the same, and bonding structure comprising the same | Chemistry; Metallurgy | 0 | Active |
| US11725117B2 | Chemical mechanical polishing of substrates containing copper and ruthenium | Chemistry; Metallurgy | 0 | Active |
| US9758886B2 | Preferably oriented nanotwinned Au film, method of preparing the same, and bonding structure comprising the same | Chemistry; Metallurgy | 0 | Active |
| US12087665B2 | Through substrate via structure and manufacturing method thereof, redistribution layer structure and manufacturing method thereof | Electricity | 0 | Active |
| US12378439B2 | Compositions for tungsten etching inhibition | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.