Patent · US Active

Quad flat semiconductor device with additional contacts

US8981541B2 · kind B2 · utility

1Cited by

4References

9Claims

0Family size

Assignee

Freeescale Semiconductor, Inc. · US

Inventors

Kong Bee Tiu · Port Klang, MY
Ruzaini B. Ibrahim · Kapar, MY
Wai Yew Lo · Petaling Jaya, MY

Key dates

Filing date	Jul 10, 2013
Grant date	Mar 17, 2015
Priority date	—
Expiry date	Jul 24, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A Quad Flat Package (QFP) semiconductor device has a multi-stepped lead frame for forming rows of external contacts. A semiconductor die is attached to a die pad of the lead frame and electrically connected to lead with bond wires. The die and bond wires are encapsulated with a mold compound and then multiple cuts are made to the lead frame to form the rows of external contacts.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.