Ruzaini B. Ibrahim
5Patents
3h-index
8Co-inventors
42Inventor score
Filing activity: Jan 27, 2006 → Jan 23, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8012799B1 | Method of assembling semiconductor device with heat spreader | Electricity | 19 | Active |
| US7432130B2 | Method of packaging semiconductor die without lead frame or substrate | Electricity | 5 | Active |
| US9064838B2 | Heat spreader for integrated circuit device | Electricity | 3 | Active |
| US8981541B2 | Quad flat semiconductor device with additional contacts | Electricity | 1 | Active |
| US9305898B2 | Semiconductor device with combined power and ground ring structure | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.