Methods and apparatus toward preventing ESC bonding adhesive erosion
US8982530B2 · kind B2 · utility
4Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2012 |
| Grant date | Mar 17, 2015 |
| Priority date | — |
| Expiry date | Mar 23, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31504
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Embodiments of the present invention provide chamber components having a protective element for shielding bonding material from processing environments in a processing environment. The protective element may include protective seals, protective structures, erosion resistive fillers, or combinations thereof. Embodiments of the present invention reduce erosion of bonding material used in a processing chamber, thus, improving processing quality and reducing maintenance costs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.