Heat sink, cooling module and coolable electronic board
US8982559B2 · kind B2 · utility
3Cited by
10References
7Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Feb 2, 2009 |
| Grant date | Mar 17, 2015 |
| Priority date | — |
| Expiry date | Jun 18, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20518
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heatsink is provided with a base body opposed to a heat generating body and absorbing heat from the heat generating body. Thermal resistance of that opposed portion of the base body which is opposed to the heat generating body is higher than thermal resistance of a surrounding portion surrounding the opposed portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.