Electro-static discharge protection for die of a multi-chip module
US8982581B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2010 |
| Grant date | Mar 17, 2015 |
| Priority date | — |
| Expiry date | Jul 16, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Electro-static discharge (“ESD”) protection for a die of a multi-chip module is described. A contact has an externally exposed surface after formation of the die and prior to assembly of the multi-chip module. The contact is for a die-to-die interconnect of the multi-chip module. The contact is for an internal node of the multi-chip module after the assembly of the multi-chip module. A driver circuit is coupled to the contact and has a first input impedance. A discharge circuit is coupled to the contact for electrostatic discharge protection of the driver circuit and has a first forward bias impedance associated with a first discharge path. The first forward bias impedance is a fraction of the first input impedance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.