Patent · US Active

Method for trimming the working layers of a double-side grinding apparatus

US8986070B2 · kind B2 · utility

0Cited by

8References

4Claims

0Family size

Assignee

Siltronic AG · DE

Inventors

Georg Pietsch · Burghausen, DE
Michael Kerstan · Burghausen, DE

Key dates

Filing date	Feb 20, 2014
Grant date	Mar 24, 2015
Priority date	—
Expiry date	Feb 20, 2034

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB24B37/28
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A method for trimming two working layers including bonded abrasive applied on mutually facing sides of an upper and a lower working disk of a grinding apparatus configured for simultaneous double-side processing of flat workpiece includes providing at least one trimming apparatus including a trimming disk, a plurality of trimming bodies and an outer toothing. The upper and lower working disks are rotated. The trimming apparatus is moved between the rotating working disks using a rolling apparatus and the outer toothing on cycloidal paths relative to working layers of the working disks. The working layers and the trimming body are brought into contact so as to release abrasive substances from the trimming bodies and so as to effect material removal from the working layers. The direction of the drives of the grinding apparatus is changed at least twice during trimming.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.