Patent · US Active

Method of manufacturing chemical mechanical polishing layers having a window

US8986585B2 · kind B2 · utility

26Cited by

3References

10Claims

0Family size

Assignee

Rohm and Haas Electronic Materials CMP Holdings, Inc. · US

Inventors

Brian T. Cantrell · Port Deposit, US
Kathleen McHugh · Newark, US
James Murnane · Norristown, US
George H. McClain · Middletown, US
Durron A. Hutt · Wilmington, US
Robert A. Brady · Newtown, US
Christopher A. Young · Newark, US
Jeffrey B. Miller · Brookline, US

Key dates

Filing date	Mar 22, 2012
Grant date	Mar 24, 2015
Priority date	—
Expiry date	Dec 16, 2033

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB24D18/0009
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A method of manufacturing polishing layers having a window for use in chemical mechanical polishing pads is provided, wherein a plurality of polishing layers having an integral window are derived from a cake, wherein the formation of density defects in the cake and the surface roughness of the polishing layers formed are minimized.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.