Patent · US Active

Formation of connectors without UBM

US8987605B2 · kind B2 · utility

1Cited by

4References

19Claims

0Family size

Assignee

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. · TW

Inventors

Tsung-Ding Wang · Tainan, TW
Hung-Jen Lin · Tainan, TW
Chien-Hsiun Lee · Baoshan, TW

Key dates

Filing date	Sep 28, 2011
Grant date	Mar 24, 2015
Priority date	—
Expiry date	Dec 31, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/00014
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A device includes a substrate, a metal pad over the substrate, and a passivation layer having a portion over the metal pad. A post-passivation interconnect (PPI) is electrically coupled to the metal pad, wherein the PPI includes a portion over the metal pad and the passivation layer. A polymer layer is over the PPI. A solder ball is over the PPI. A compound includes a portion adjoining the solder ball and the polymer layer, wherein the compound includes flux and a polymer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.