Encapsulation of electrodes in solid media
US8987678B2 · kind B2 · utility
1Cited by
61References
25Claims
0Family size
Assignee
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Key dates
| Filing date | Apr 2, 2012 |
| Grant date | Mar 24, 2015 |
| Priority date | — |
| Expiry date | Jun 22, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05H2242/24
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
An inductively-coupled plasma source for a focused charged particle beam system includes a conductive shield that provides improved electrical isolation and reduced capacitive RF coupling and a dielectric fluid that insulates and cools the plasma chamber. The conductive shield may be enclosed in a solid dielectric media. The dielectric fluid may be circulated by a pump or not circulated by a pump. A heat tube can be used to cool the dielectric fluid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.