Integrated circuit package connected to an optical data transmission medium using a coolant
US8989532B2 · kind B2 · utility
3Cited by
2References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2011 |
| Grant date | Mar 24, 2015 |
| Priority date | — |
| Expiry date | Feb 9, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/122
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An integrated circuit coupling device includes an integrated circuit package; and an optical data transmission medium connected to the integrated circuit package, and comprising a movable coolant, adapted to remove heat from the integrated circuit package, in operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.