PNP apparatus and PNP tool head with direct bonding pressure pick-up tip
US9003644B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2012 |
| Grant date | Apr 14, 2015 |
| Priority date | — |
| Expiry date | Feb 1, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53191
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A PNP apparatus may include a robotic arm, and a PNP tool head carried by the robotic arm. The PNP tool head may include a body configured to apply bonding pressure to a first area of an electronic device, and a pick-up tip movable between an extended position and a retracted position relative to the body as the pick-up tip rests against a second area of the electronic device. The pick-up tip may define a vacuum passageway therethrough to couple a vacuum source to the second area of the electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.