Methods and apparatus for displacing fluids from substrates using supercritical CO2
US9004086B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 4, 2010 |
| Grant date | Apr 14, 2015 |
| Priority date | — |
| Expiry date | Jan 12, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02101
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A processing chamber for post-wet-etch removing of drying fluid (DF) is disclosed. The chamber includes a chamber wall surrounding a processing volume and a plurality of nozzles disposed annularly about the processing volume and arranged into a set of nozzle rows that includes at least one nozzle row. The chamber also includes a plenum and a set of manifolds coupled to the plurality of nozzles to deliver the supercritical CO2 to the plurality of nozzles. Each nozzle has a nozzle outlet directed toward an interior portion of the processing volume and the nozzles are configured to flow the supercritical CO2 toward the substrates in a manner that minimizes recirculation loops and vortices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.