Magnet arrangement for a target backing tube, target backing tube including the same, cylindrical target assembly and sputtering system
US9005414B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2010 |
| Grant date | Apr 14, 2015 |
| Priority date | — |
| Expiry date | Apr 16, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3461
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The disclosure relates to a magnet arrangement for a sputtering system, wherein the magnet arrangement is adapted for a rotatable target of a sputtering system and includes: a first magnet element extending along a first axis; a second magnet element being disposed around the first magnet element symmetrically to a first plane; wherein the second magnet element includes at least one magnet section intersecting the first plane; and wherein a magnetic axis of the at least one magnet section is inclined with respect to a second plane being orthogonal to the first axis. Further, the disclosure relates to a target backing tube for a rotatable target of a sputtering system, a cylindrical rotatable target for a sputtering system, and a sputtering system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.