Tj temperature calibration, measurement and control of semiconductor devices
US9006000B2 · kind B2 · utility
10Cited by
11References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 3, 2012 |
| Grant date | Apr 14, 2015 |
| Priority date | — |
| Expiry date | Jul 17, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor device, such as a semiconductor die, is disclosed including embedded temperature sensors for scanning the junction temperature, Tj, at one or more locations of the semiconductor die while the die is operating. Once a temperature of a hot spot is detected that is above a temperature specified for the die or package containing the die, the die/package may be discarded. Alternatively, the functionality of the die may be altered in a way that reduces the temperature of the hot spots.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.