Methods for fabricating integrated circuits including generating photomasks for directed self-assembly
US9009634B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 8, 2013 |
| Grant date | Apr 14, 2015 |
| Priority date | — |
| Expiry date | Jul 8, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB82Y30/00
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Methods for fabricating integrated circuits are provided. In one example, a method for fabricating an integrated circuit includes generating a photomask for forming a DSA directing pattern on a semiconductor substrate. The DSA directing pattern is configured to guide a self-assembly material deposited thereon that undergoes directed self-assembly (DSA) to form a DSA pattern. Generating the photomask includes, using a computing system, inputting a DSA target pattern. Using the computing system, a DSA model, an OPC model, and a MPC model, cooperatively running a DSA PC algorithm, an OPC algorithm, and a MPC algorithm to produce an output MPCed pattern for a mask writer to write on the photomask.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.