Method for treating a bond pad of a package substrate
US9012263B1 · kind B1 · utility
43Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2013 |
| Grant date | Apr 21, 2015 |
| Priority date | — |
| Expiry date | Oct 31, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of making a package substrate having a copper bond pad and a location for receiving a semiconductor die having a remnant of one of a group consisting of HEDP and an HEDP derivative on a top surface of the copper bond pad. The semiconductor die is attached to the substrate. A wirebond connection is attached between the remnant and the semiconductor die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.