Stacked and staggered die MEMS package and method

US9013011B1 · kind B1 · utility

Assignee

• Amkor Technology, Inc. · US

Inventors

• Bob Shih-Wei Kuo · Chandler, US
• Brett Dunlap · Queen Creek, US
• Louis B. Troche, Jr. · Gilbert, US
• Ahmer Syed · Chandler, US
• Russell Shumway · Tempe, US

Key dates

• Filing date: Mar 11, 2011
• Grant date: Apr 21, 2015
• Expiry date: Sep 3, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/73265

Abstract

A staggered die MEMS package includes a substrate having a converter cavity formed therein. A converter electronic component is mounted within the converter cavity. Further, a MEMS electronic component is mounted to both the substrate and the converter electronic component in a staggered die arrangement. By staggering the MEMS electronic component directly on the converter electronic component instead of locating the MEMS electronic component in a side by side arrangement with the converter electronic component, the total package width of the staggered die MEMS package is minimized. Further, by locating the converter electronic component within the converter cavity and staggering the MEMS electronic component directly on the converter electronic component, the total package height, sometimes called Z-height, of the staggered die MEMS package is minimized.