Mixed alloy solder paste
US9017446B2 · kind B2 · utility
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27Claims
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Key dates
| Filing date | May 3, 2010 |
| Grant date | Apr 28, 2015 |
| Priority date | — |
| Expiry date | Jan 12, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12493
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A solder paste comprises an amount of a first solder alloy powder between about 60 wt % to about 92 wt %; an amount of a second solder alloy powder greater than 0 wt % and less than about 12 wt %; and a flux; wherein the first solder alloy powder comprises a first solder alloy that has a solidus temperature above about 260° C.; and wherein the second solder alloy powder comprises a second solder alloy that has a solidus temperature that is less than about 250° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.