Conductor with sub-lithographic self-aligned 3D confinement
US9024411B2 · kind B2 · utility
3Cited by
3References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 12, 2013 |
| Grant date | May 5, 2015 |
| Priority date | — |
| Expiry date | Aug 12, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A three-dimensionally (3d) confined conductor advantageously used as an electronic fuse and self-aligned methods of forming the same. By non-conformal deposition of a dielectric film over raised structures, a 3d confined tube, which may be sub-lithographic, is formed between the raised structures. Etching holes which intersect the 3d confined region and subsequent metal deposition fills the 3d confined region and forms contacts. When the raised structures are gates, the fuse element may be located at the middle of the line (i.e. in pre-metal dielectric). Other methods for creating the structure are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.