Multiple helix substrate and three-dimensional package with same
US9024427B2 · kind B2 · utility
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2References
9Claims
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Key dates
| Filing date | Feb 11, 2014 |
| Grant date | May 5, 2015 |
| Priority date | — |
| Expiry date | Feb 11, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A three dimensional package includes a substrate having a columnar part including a sidewall, and stairs or steps arranged along the sidewall of the columnar part in the form of multiple helixes twisted around the columnar part. Semiconductor integrated circuits (IC dies) are attached on one or both of the supporting surfaces of the stairs. The columnar part, the stairs and the IC dies can be encapsulated with a mold compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.