Aipeng Shu
3Patents
0h-index
7Co-inventors
21Inventor score
Filing activity: Feb 11, 2014 → Nov 23, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9024427B2 | Multiple helix substrate and three-dimensional package with same | Emerging Cross-Sectional Technologies | 0 | Active |
| US9214413B2 | Semiconductor die package with pre-molded die | Electricity | 0 | Active |
| US9252114B2 | Semiconductor device grid array package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.